Heat pipes have proven to be the excepted means of providing thermal control in notebook and Mobil PCs systems. Heat pipes can move and dissipate CPU generate heat selectively throughout the system without affecting temperature sensitive components. Low wattage heat pipes (under 20 watts) have standardized input plates to the heat pipe. The connection to the heat exchanger via the heat pipe can have any number of configurations to accommodate component placement, multiple power ranges and fan options.
The heat pipe solutions for thermal control at this level is a component and overall systems requirement. Not only do the heat pipes take on a different configuration with multiple heat pipes and cooling fins, but also airflow becomes the critical design factor. Heat pipes designed to move 75 watts are usually flat with fin stacks from three to six inches, in many cases with fins mounted on each side of the CPU input pad. Input pads are standard using stand-offs, transition sockets, and bolster plates on the bottom of the PC board. The spring clips used on the fan/heat sink combination won’t work here. Airflow management is important in the overall efficiency of the heat pipe and should be calculated along with the intended heat pipe design.
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 Figure 3: Heat Pipe on a 500 MHz System |
Thermal solutions are normally designed with multiple heat pipes, dedicated airflow and maximum input area. Fins stacks typically extend over both sides of the CPU. Input attachment to the CPU is with stand-offs, transition sockets or bolster plates.
The 500MHz operating system shown in Figure 3 uses two thermal products, heat pipes to transfer the CPU heat (100 to 300 watts) and a second internal or external cooling source. Input power is generated from multiple CPUs and components with single or multiple heat pipes. Cooling temperatures on the output range from -0° C to - 40° C. This system requires thermal isolation because of dewpoint considerations
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